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90-99% Ceramic Connector Blocks Special Functional Alumina Ceramics Parts

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xProduct Name | Ceramic Connector Blocks / Special Functional Ceramics Parts | AL2O3 Content | 90% - 99% |
---|---|---|---|
Tensile | 30 Kpsi - 32 Kpsi | Flexural | 55 Kpsi - 60 Kpsi |
Compressive | 300 Kpsi - 330 Kpsi | Density | 3.7 G/cc - 3.92 G/cc |
Hardness | 13.8 HV, Gpa - 18 HV, Gpa | Thermal Conductivity | 25 W/(m K) - 32 W/(m K) |
C.O.T.E | 75 In / In°C (x10^7) - 78 In / In°C (x10^7) | Working Temperature | 1500 °C - 1750 °C |
Dielectric Constant | 9.5 - 9.8 | Volume Resistivity | >10^14 Ohm-cm |
Dielectric Strength | 16 KV/mm - 20 KV/mm | ||
Highlight | Alumina Ceramic Connector Blocks,90% Ceramic Connector Blocks,99% Alumina Ceramics Parts |
Ceramic Connector Blocks / Special Functional Ceramics Parts
1. Description:
The purpose of the integrated circuit package is to contain the silicon device and to connect it to the external electric circuitry. The packaging materials must have low dielectric constants (in order to minimize the delay in signal processing), and they must conduct heat away from the semiconductor devices. Alumina is poor on both counts. Higher-thermal-conductivity materials exist, but they are either toxic (as in the case of beryllium oxide, BeO) or are poor cofiring ceramics (e.g., aluminum nitride, AlN). Glass-ceramic formations have been developed that are easy to process, have low dielectric constants, and also match the thermal expansion coefficients of high-conductivity metals (gold and copper) that are used in electric circuitry. However, they have low strengths and low thermal conductivities.
1) High hardness and high density
2) Low thermal conductivity
3) Chemical inertness
4) Good wear resistance
5) High Fracture toughness
6) Good insulation performance
7) High temperature resistance
8) A variety of specifications is available
9) Satisfy various technical requests
10) Lower medium spoilage
11) Stiffness texture
12) Chemical inertness
13) Good wear resistance
14) High Fracture toughness
15) Good insulation performance
3. Material Features / Properties:
Color | White or Ivory | White or Ivory | White or Ivory | |
Density | g/cm 3 | 3.82 | 3.9 | 3.92 |
Hardness | HRA | 83 | 85 | 85 |
Flexural Strength | Mpa (psi*10 3 ) | 375 | 386 | 381 |
4. Technical Parameters:
Technical Parameters of Ceramics | ||||||||
Items | Test Conditions | Unit or Symbol | 99% AL2O3 | 95% AL2O3 | 90% AL2O3 | Zirconia | Steatite | Silicon Carbide |
Volume Density | -- | g/cm3 | ≥3.70 | ≥3.62 | ≥3.40 | ≥5.90 | ≥2.60 | ≥3.08 |
Tightness | -- | Pa·m³/s | ≤1.0×10-11 | ≤1.0×10-11 | ≤1.0×10-11 | - | - | - |
Liquid Permeability | -- | -- | Pass | Pass | Pass | Pass | - | |
Flexural Strength | - | MPa | ≥300 | ≥280 | ≥230 | ≥1100 | ≥120 | ≥400 |
Elastic Modulus | - | GPa | - | ≥280 | ≥250 | ≥220 | - | 400 |
Poisson Ratio | - | - | - | 0.20~0.25 | 0.20~0.25 | - | - | - |
Thermal Shock Resistance | 800℃( Room Temperature) Cycle: 10 times | Pass | Pass | Pass | - | - | - | |
Coefficient of Linear Expansion | 20℃~100℃ | ×10-6 K-1 | - | - | - | ≤8 | - | |
20℃~500℃ | ×10-6 K-1 | 6.5~7.5 | 6.5~7.5 | 6.5~7.5 | 6.5~11.2 | - | - | |
20℃~800℃ | ×10-6 K-1 | 6.5~8.0 | 6.5~8.0 | 6.3~7.3 | - | 4 | ||
20℃~1200℃ | ×10-6 K-1 | - | 7.0~8.5 | - | - | - | - | |
Coefficient of Thermal Conductivity | 20℃ | W/(m·k) | - | - | - | - | - | 90~110 |
1000℃ | ||||||||
Dielectric Constant | 1MHz 20℃ | - | 9.0~10.5 | 9.0~10 | 9.0~10 | - | ≤7.5 | - |
1MHz 50℃ | - | - | 9.0~10 | - | - | - | - | |
10GHz 20℃ | - | 9.0~10.5 | 9.0~10 | 9.0~10 | - | - | - | |
Volume Resistivity | 100℃ | Ω·cm | ≥1.0×1013 | ≥1.0×1013 | ≥1.0×1013 | - | ≥1.0×1012 | - |
300℃ | ≥1.0×1013 | ≥1.0×1010 | ≥1.0×1013 | - | - | - | ||
500℃ | ≥1.0×109 | ≥1.0×108 | -- | - | - | - | ||
Disruptive Strength | D.C | kV/mm | ≥17 | ≥15 | ≥15 | - | ≥20 | - |
Chemical Durability | 1:9HCl | mg/c㎡ | ≤0.7 | ≤7.0 | - | - | - | - |
10%NaOH | mg/c㎡ | ≤0.1 | ≤0.2 | - | -- | - | - | |
Grain Size | - | μm | - | 3~12 | - | - | - | - |
5. Process Flows:
Formulating --- Granulating --- Forming --- Sintering --- Grinding --- Printing --- Nickel Plating --- Assembing --- Brazing --- Inspecting --- Packing
6. Application Fields:
Widely apply for new energy vehicles, charging piles, solar power generation, energy storage and power storage system, electric vehicle power system and so on.
7. Production Facilities: Prilling Tower , Forming Machine , High Temperature Sintering Kiln
8. Detection Devices:
Electric Performance Tester , Film Thickness Analyzer , Granulometer , Helium Mass Spectrometer Leak Detector , Universal Pull Force Meter
9.Order Flow Steps as belows: Inquiry ---Quotation --- Place an order --- Production --- Delivery
10. Our advantages: Quality Assurance ; Price Competitive ; Factory Supply Directly ; Good Service
11.Shipping and Package:
12. Our aimed market :
Notes:Above information only for reference and please contact with us for more details freely when you have any inquiry!