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Alumina Ceramic Components
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Ceramic Housing
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Metallized Alumina Ceramics
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Alumina Ceramic Insulator
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Alumina Ceramic Rings
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Pressure Sensor Ceramic
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Advanced Technical Ceramics
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Fuse Ceramic
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Ceramic Connector Blocks
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Electronic Ceramic Components
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Magnetron Ceramic
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Zirconia Ceramic Parts
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Alumina Ceramic Rods
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Wear Resistant Machinable Ceramic Connector Blocks Materials ISO14001

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xProduct Name | Ceramic Connector Blocks / Special Functional Ceramics Parts | AL2O3 Content | 90% - 99% |
---|---|---|---|
Tensile | 30 Kpsi - 32 Kpsi | Flexural | 55 Kpsi - 60 Kpsi |
Compressive | 300 Kpsi - 330 Kpsi | Density | 3.7 G/cc - 3.92 G/cc |
Hardness | 13.8 HV, Gpa - 18 HV, Gpa | Thermal Conductivity | 25 W/(m K) - 32 W/(m K) |
C.O.T.E | 75 In / In°C (x10^7) - 78 In / In°C (x10^7) | Working Temperature | 1500 °C - 1750 °C |
Dielectric Constant | 9.5 - 9.8 | Volume Resistivity | >10^14 Ohm-cm |
Dielectric Strength | 16 KV/mm - 20 KV/mm | ||
Highlight | Wear Resistant Ceramic Connector Blocks,ISO14001 Ceramic Connector Blocks,ISO14001 machinable ceramic materials |
Ceramic Connector Blocks / Special Functional Ceramics Parts
1. Description:
In the past, multilayer ceramic substrate alumina green sheets were developed which showed promise for use in high-density packaging substrates. Because this substrate sinters only at high temperatures (>1500 °C), it is necessary to use molybdenum or tungsten as the conductor and to sinter in a reducing atmosphere in order to prevent oxidation of these metal. In conventional packaging technology with high dielectric constant alumina (ε = 9–10), the delay introduced in the package exceeds the chip delay. Therefore, it is necessary to reduce the dielectric constant for the substrate to below that for alumina.
1) High hardness and high density
2) Low thermal conductivity
3) Chemical inertness
4) Good wear resistance
5) High Fracture toughness
6) Good insulation performance
7) High temperature resistance
8) A variety of specifications is available
9) Satisfy various technical requests
10) Lower medium spoilage
11) Stiffness texture
12) Chemical inertness
13) Good wear resistance
14) High Fracture toughness
15) Good insulation performance
3. Material Features / Properties:
Color | White or Ivory | White or Ivory | White or Ivory | |
Density | g/cm 3 | 3.82 | 3.9 | 3.92 |
Hardness | HRA | 83 | 85 | 85 |
Flexural Strength | Mpa (psi*10 3 ) | 375 | 386 | 381 |
4. Technical Parameters:
Technical Parameters of Ceramics | ||||||||
Items | Test Conditions | Unit or Symbol | 99% AL2O3 | 95% AL2O3 | 90% AL2O3 | Zirconia | Steatite | Silicon Carbide |
Volume Density | -- | g/cm3 | ≥3.70 | ≥3.62 | ≥3.40 | ≥5.90 | ≥2.60 | ≥3.08 |
Tightness | -- | Pa·m³/s | ≤1.0×10-11 | ≤1.0×10-11 | ≤1.0×10-11 | - | - | - |
Liquid Permeability | -- | -- | Pass | Pass | Pass | Pass | - | |
Flexural Strength | - | MPa | ≥300 | ≥280 | ≥230 | ≥1100 | ≥120 | ≥400 |
Elastic Modulus | - | GPa | - | ≥280 | ≥250 | ≥220 | - | 400 |
Poisson Ratio | - | - | - | 0.20~0.25 | 0.20~0.25 | - | - | - |
Thermal Shock Resistance | 800℃( Room Temperature) Cycle: 10 times | Pass | Pass | Pass | - | - | - | |
Coefficient of Linear Expansion | 20℃~100℃ | ×10-6 K-1 | - | - | - | ≤8 | - | |
20℃~500℃ | ×10-6 K-1 | 6.5~7.5 | 6.5~7.5 | 6.5~7.5 | 6.5~11.2 | - | - | |
20℃~800℃ | ×10-6 K-1 | 6.5~8.0 | 6.5~8.0 | 6.3~7.3 | - | 4 | ||
20℃~1200℃ | ×10-6 K-1 | - | 7.0~8.5 | - | - | - | - | |
Coefficient of Thermal Conductivity | 20℃ | W/(m·k) | - | - | - | - | - | 90~110 |
1000℃ | ||||||||
Dielectric Constant | 1MHz 20℃ | - | 9.0~10.5 | 9.0~10 | 9.0~10 | - | ≤7.5 | - |
1MHz 50℃ | - | - | 9.0~10 | - | - | - | - | |
10GHz 20℃ | - | 9.0~10.5 | 9.0~10 | 9.0~10 | - | - | - | |
Volume Resistivity | 100℃ | Ω·cm | ≥1.0×1013 | ≥1.0×1013 | ≥1.0×1013 | - | ≥1.0×1012 | - |
300℃ | ≥1.0×1013 | ≥1.0×1010 | ≥1.0×1013 | - | - | - | ||
500℃ | ≥1.0×109 | ≥1.0×108 | -- | - | - | - | ||
Disruptive Strength | D.C | kV/mm | ≥17 | ≥15 | ≥15 | - | ≥20 | - |
Chemical Durability | 1:9HCl | mg/c㎡ | ≤0.7 | ≤7.0 | - | - | - | - |
10%NaOH | mg/c㎡ | ≤0.1 | ≤0.2 | - | -- | - | - | |
Grain Size | - | μm | - | 3~12 | - | - | - | - |
5. Process Flows:
Formulating --- Granulating --- Forming --- Sintering --- Grinding --- Printing --- Nickel Plating --- Assembing --- Brazing --- Inspecting --- Packing
6. Application Fields:
Widely apply for new energy vehicles, charging piles, solar power generation, energy storage and power storage system, electric vehicle power system and so on.
7. Production Facilities: Prilling Tower , Forming Machine , High Temperature Sintering Kiln
8. Detection Devices:
Electric Performance Tester , Film Thickness Analyzer , Granulometer , Helium Mass Spectrometer Leak Detector , Universal Pull Force Meter
9.Order Flow Steps as belows: Inquiry ---Quotation --- Place an order --- Production --- Delivery
10. Our advantages: Quality Assurance ; Price Competitive ; Factory Supply Directly ; Good Service
11.Shipping and Package:
12. Our aimed market :
Notes:Above information only for reference and please contact with us for more details freely when you have any inquiry!